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this is information on a product in full production. august 2014 docid026543 rev 3 1/14 14 BALF-NRG-01D3 50 ? nominal input / conjugate match balun to bluenrg transceiver, with integrated harmonic filter datasheet ? production data features ? 50 ? nominal input / conjugate match to bluenrg device ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? wafer level chip scale package (wlcsp) benefits ? very low profile: < 670 m ? high rf performance ? rf bom reduction ? small footprint applications ? bluetooth low energy impedance matched balun filter ? optimized for st bluenrg rfic description stmicroelectronics BALF-NRG-01D3 is an ultra miniature balun. the BALF-NRG-01D3 integrates matching network and harmonics filter. matching impedance has been customized for the bluenrg st transceiver (both qfn and wlcsp versions). it is using stmicroelectronics ipd technology on non conductive glass substrate which optimizes rf performance. figure 1. application schematic with qfn type bluenrg figure 2. application schematic with wlcsp type bluenrg flip-chip package 4 bumps www.st.com
characteristics BALF-NRG-01D3 2/14 docid026543 rev 3 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rfin - 10 dbm v esd esd ratings human body model (jesd22-a114-c), all i/o one at a time while others connected to gnd 2000 - v esd ratings machine model (mm: c = 200 pf, r = 25 ? , l = 500 nh) 200 - t op operating temperature -40 - +85 c table 2. impedances (t amb = 25 c) symbol parameter value unit min. typ. max. z diff nominal differential impedance - match to bluenrg - ? z ant antenna impedance - 50 - ? table 3. rf performance (t amb = 25 c) symbol parameter test condition value unit min. typ. max. f frequency range (bandwidth) 2400 2500 mhz s11 input return loss bandwidth -20 db s21 insertion loss -1.1 db s21 harmonic rejection (differential mode) h2 -8 db h3 -38 h4 -31 h5 -23 phase_imbal output phase imbalance 7 ampl_imbal output amplitude imbalance 0.5 db
docid026543 rev 3 3/14 BALF-NRG-01D3 characteristics figure 3. differential transmission figure 4. return loss g% i*+] g% i*+] figure 5. insertion loss figure 6. h2 filtering g% i*+] g% i*+] figure 7. h3 filtering figure 8. h4 filtering g% i*+] g% i*+]
characteristics BALF-NRG-01D3 4/14 docid026543 rev 3 figure 9. h5 filtering figure 10. amplitude imbalance g% i*+] g% i*+] figure 11. phase imbalance ghj i*+]
docid026543 rev 3 5/14 BALF-NRG-01D3 BALF-NRG-01D3 with qfn type bluenrg 2 BALF-NRG-01D3 with qfn type bluenrg figure 12. application board evb (2 layers) figure 13. recommended balun land pattern (evb) smt = 320 m 180 m 254 m top and spt = 220 m
BALF-NRG-01D3 with qfn type bluenrg BALF-NRG-01D3 6/14 docid026543 rev 3 2.1 BALF-NRG-01D3 measurements on qfn evb figure 14. harmonics figure 15. sensitivity figure 16. pout
docid026543 rev 3 7/14 BALF-NRG-01D3 BALF-NRG-01D3 with wlcsp type bluenrg 3 BALF-NRG-01D3 with wlcsp type bluenrg figure 17. recommended balun land pattern (wlcsp) figure 18. 800 m 220 m
BALF-NRG-01D3 with wlcsp type bluenrg BALF-NRG-01D3 8/14 docid026543 rev 3 3.1 BALF-NRG-01D3 measurements on wlcsp evb figure 19. harmonics figure 20. sensitivity figure 21. pout
docid026543 rev 3 9/14 BALF-NRG-01D3 package information 4 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 22. package drawing d1 d e1 fd fe e a2 $ a1 ccc a ?b se
package information BALF-NRG-01D3 10/14 docid026543 rev 3 table 4. package dimensions dim. mm min. typ. max. a 0.580 0.630 0.680 a1 0.180 0.205 0.230 a2 0.380 0.40 0.420 b 0.230 0.255 0.280 d 1.375 1.40 1.425 d1 0.99 1 1.01 e 0.825 0.85 0.875 e1 0.39 0.4 0.41 se 0.2 fd 0.17 0.2 0.23 fe 0.195 0.225 0.255 ccc 0.05 $0.025 figure 23. footprint - non solder mask defined figure 24. footprint - solder mask defined copper pad diameter: 220m recommended 180m minimum 260m maximum solder mask opening: 320m recommended 300m minimum 340m maximum solder stencil opening: 220m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening: 220m recommended 180m minimum 260m maximum copper pad diameter: 320m recommended 300m minimum solder stencil opening : 220m recommended
docid026543 rev 3 11/14 BALF-NRG-01D3 package information figure 25. ball assignment table 5. ball assignment details ball name description a1 ant antenna connection a2 gnd ground b1 rx_p balun receive positive output b2 rx_n balun receive negative output
package information BALF-NRG-01D3 12/14 docid026543 rev 3 figure 26. flip chip tape and reel specifications note: more information is available in the stmicroelectronics application notes: an2348 flip-chip: ?package description and recommendations for use? 'rwlghqwli\lqj3lq $orfdwlrq 8vhugluhfwlrqrixquhholqj $ooglphqvlrqvduhw\slfdoydoxhvlqpp ? ? ? ? ? ?? ? ? ? ? 67 67 67 [[] [[] [[] \zz \zz \zz
docid026543 rev 3 13/14 BALF-NRG-01D3 ordering information 5 ordering information 6 revision history table 6. ordering information order code marking weight base qty delivery mode BALF-NRG-01D3 sv 1.35 mg 5000 tape and reel (7?) table 7. document revision history date revision changes 17-jun-2014 1 initial release 17-jul-2014 2 updated figure 13 , figure 17 , figure 22 and package view on cover page. corrected typo error on table 2 . 18-aug-2014 3 updated title and description in cover page.
BALF-NRG-01D3 14/14 docid026543 rev 3 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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